Japan introduces chip-making equipment export controls
Earlier this morning Japan introduced export controls on chip-making equipment capable of sub-14nm processing.
This article was posted on Apr 7, 2023Precision 1206 resistors handle 1W
Stackpole’s RNCU 1206 thin film chip resistors can handle up to 1W and offer tolerances down to 0.1% and temperature coefficients down to 10ppm/°C.
This article was posted on Apr 7, 2023Corrosion protection for electrical cabinets
Cortec’s EcoEmitter is a stick-on capsule designed to protect un-ventilated enclosed electronic and optical equipment from corrosion.
This article was posted on Apr 7, 20231.2kV 80mΩ SiC mosfet comes in TO247-4
Diodes has introduced silicon carbide mosfet rated at 1,200V and 37A for industrial motor drives, solar inverters and electric vehicle battery chargers.
This article was posted on Apr 7, 2023Sponsored Content: Universal and compact AC/DC converters from Aimtec
Power supply component failures are perhaps the most common malfunctions affecting electronic devices.
This article was posted on Apr 7, 2023General-purpose MCU power measurement in ST’s debug probe
STMicroelectronics had built a general purpose power consumption tester and a general purpose power supply for any ≤3.6V microcontroller into its latest programme/debug probe for STM32 MCUs.
This article was posted on Apr 7, 2023Isar Aerospace raises €165m Series C for Spectrum launcher
Isar Aerospace, the Munich-based launch service provider for small and medium satellites, has raised €165m in a Series C funding round.
This article was posted on Apr 6, 2023Auto the one bright spot, says SI
Automotive appears to be about the only bright spot in the semiconductor market for 2023., says Seniconductor Intelligence.
This article was posted on Apr 6, 2023China imports of IC manufacturing equipment fell 15% last year
Last year, shipments of semiconductor manufacturing equipment from the U.S. and Japan to China fell for the first time in three years, reports the Nikkei.
This article was posted on Apr 6, 2023Fan-out packaging revenue growing at 12.5% CAGR
Fan-out (FO) packaging revenue is expected to reach $3.8 billion in 2028, with a CAGR 2022-2028 of 12.5%, says Yole Developpement.
This article was posted on Apr 6, 2023Foldables to grow 50%
IDC expects worldwide shipments of foldable phones, including flip and fold form factors, to grow over 50% to reach 21.4 million units in 2023 compared to the 14.2 million units shipped in 2022.
This article was posted on Apr 6, 2023OneWeb completes constellation of LEO satellites for global connectivity
OneWeb is celebrating the completion of its low Earth orbit (LEO) constellation, following the launch of 36 Airbus OneWeb Satellites using the Indian Space Research Organisation (ISRO) and NewSpace India Limited (NSIL).
This article was posted on Apr 6, 20233D printing of metals not yet a science
Researchers have not yet got the additive manufacturing, or 3D printing, of metals down to a science completely.
This article was posted on Apr 6, 2023Intel sampling Sierra Forest
Intel is sampling its 144-core Sierra Forest Xeon datacentre processor and plans to mass-produce it in H1 2024.
This article was posted on Apr 6, 2023New licence to end open-source abuse?
Open-source licencing needs a re-think in the face of intellectual property abuse, according to open-source advocate Josef Prusa, founder of 3D printer maker Prusa Research (pictured), which publishes full design files for its products.
This article was posted on Apr 6, 2023Li-ion management IC for batteries up to 25V
For Li-ion battery packs up to 25V, STMicroelectronics has introduced an IC for monitoring, balancing and protection, aiming at cordless power tools, back-up energy storage and medical devices.
This article was posted on Apr 6, 2023Smart textile sensor measures body movement to detect onset of fatigue
ETH Zurich has created a yarn whose capacitance varies significantly with the movement of the textile it is woven into.
This article was posted on Apr 4, 2023ASFETs for hot-swap and soft-start
Nexperia is shipping 80V and 100V application-specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in an 8×8 mm LFPAK88 package.
This article was posted on Apr 4, 2023NRO announces commercial contracts for space-based hyperspectral imagery
The U.S. National Reconnaissance Office (NRO), which is responsible for space-based intelligence, has awarded six study contracts around commercial hyperspectral imagery.
This article was posted on Apr 4, 2023Virginia Tech endorses CQD ICeGaN technology
Cambridge GaN Devices (CGD) has had its ICeGaN technology endorsed in a paper by Virginia Tech as more reliable and robust than other GaN platforms.
This article was posted on Apr 4, 2023Gordon Moore
Last Friday, Gordon Moore died in Hawaii at the age of 94.
This article was posted on Apr 4, 2023