China’s imports of ICs fell 31% y-o-y in January and February to $47.8 billion from $68.8 billion last year, according to China’s General Administration of Customs.
This article was posted on Mar 17, 2023IQE, the compound wafer specialist, says its H1 revenues will be lower than expected because of weaker demand leading to inventory build-up throughout the supply chain.”
This article was posted on Mar 17, 2023Following the collapse of the US bank Silicon Valley Bank (SVB), HSBC has bought its UK subsidiary, SVB UK, for £1.
This article was posted on Mar 17, 2023Intrinsic Semiconductor Technologies, the RRAM spin-out from UCL, has secured £7 million in a funding round led by Octopus Ventures and supported by existing investors IP Group and the UCL Technology Fund plus £1m from Innovate UK.
This article was posted on Mar 17, 2023Embedded World returns to its more conventional diary slot (14-16 March) in Nuremberg, Germany. There are exhibitors in halls 1, 2, 3, 3A, 4 and 4A, covering application software and systems, embedded design, IC and IP design, M2M, safety and security, displays and startups. Caroline Hayes has curated some highlights to look for.
This article was posted on Mar 17, 2023Humane, a five year-old startup founded by former Apple employees, has had a Series C funding round raising $100 million taking its total VC funding to date to $230 million.
This article was posted on Mar 16, 2023Merck and Intel are funding an academic research programme aimed at enabling more sustainable semiconductor manufacturing.
This article was posted on Mar 16, 2023A large, 21.5-inch TFT LCD display available from Relec Electronics is designed for easy integration into equipment that is used outdoors. The HA-215HVEEUAB0-AA has a large active area of 476.06mm x 267.79mm and an aspect ratio of 16:9. Resolution is 1920 x 1080. A high brightness level of 500cd/m2 ensures reliable performance in a wide variety of indoor applications and environments, from medical and industrial use to marine and defence applications.
This article was posted on Mar 16, 2023Toshiba is aiming at 60kHz power factor correction stages with a 650V 60A reduced switching loss IGBT.
This article was posted on Mar 16, 2023Rohm has announced a high-side current sensor with a -0.2 to +26V input common-mode range and ±1.0% maximum gain error.
This article was posted on Mar 16, 2023Arrow Electronics is collaborating with Nvidia following a global distribution agreement to supply the Drive AGX Orin developer kit. The scalable hardware and software autonomous vehicle platform can be used by automotive OEMs, developers, research centres, and universities.
This article was posted on Mar 16, 2023Ubotica Technologies, the space AI specialist, has officially announced its CogniSAT-CRC system, applying its CogniSAT technology for Earth Observation.
This article was posted on Mar 16, 2023Q4 smartphone production was up 4% QoQ but down 15.5% YoY to 301 million units for 4Q22, says TrendForce. 2022 production was 10.6% down on 2021 at 1,192 billion units
This article was posted on Mar 16, 2023Computing revenue for the two main automotive segments – ADAS and cockpit processors – is increasing at a CAGR22-28 of 13% to reach $12.7 billion in 2028, says Yole Developpement.
This article was posted on Mar 16, 2023Mythic, the analogue processor startup, has raised $13 million with existing investors Atreides Management, DCVC, and Lux Capital contributing plus new investors Catapult Ventures and Hermann Hauser Investment.
This article was posted on Mar 16, 2023EPC has created a GaN-based USB PD 3.1 dc-dc evaluation module around one of its integrated power stages and a low-profile (3mm) inductor.
This article was posted on Mar 9, 2023Yangtze Memory is reported to be about to get another $1.9 billion from the China government.
This article was posted on Mar 9, 2023Inspired by its professional range, Arduino has put dual Arm cores, Wi-Fi, Bluetooth LE and 76 IOs into its Mega form-factor.
This article was posted on Mar 9, 2023Toshiba has introduced a brushless dc motor driver that supports ASIL-D for functional safety in vehicles.
This article was posted on Mar 8, 2023Officials representing the Fab 4 US-Japan-Korea-Taiwan grouping to resolve semiconductor industry issues have held their first video meeting. No companies participated and export controls were off the agenda.
This article was posted on Mar 7, 2023By 2030 the US will set up ‘at least’ two semiconductor clusters to produce advanced ICs, said US Commerce Secretary Gina Raimondo (pictured) last week, when outlining plans for spending the $250 billion of Chips and Science Act money.
This article was posted on Mar 7, 2023