Gbit broadband facilitised for flat dwellers
Amendments to the Building Regulations 2010 and the Telecommunications Infrastructure (Leasehold Property) Act (TILPA) which came into force on December 26th last year, mean that new homes in England will be built with gigabit broadband connections and landlords are now obliged to provide access to broadband providers seeking to instal equipment.
This article was posted on Jan 12, 20232,000Top/s computer takes AI to automated driving
Recogni has combined its 7nm Scorpio AI processor with a 7nm Renesas R-Car V4H ASIL D processor IC – which is already AI-capable – to create a 2,000Top/s embedded computer for vehicles that self-drive at SAE levels L2+ to L4.
This article was posted on Jan 12, 2023CES: Dirac in-car audio for up to nine speakers
Dirac announced digital audio software for entry-level vehicle sound systems using NXP ICs at CES today.
This article was posted on Jan 12, 2023NXP adds to RFCMOS radar ICs
NXP is sampling a 28nm RFCMOS radar one-chip IC family for ADAS.
This article was posted on Jan 12, 2023General Atomics to build AFRL satellite for tracking cislunar space
General Atomics Electromagnetic Systems (GA-EMS) will be building an ESPA-Grande class satellite, perform payload integration, and space vehicle test for the Air Force Research Laboratory (AFRL) Oracle spacecraft programme.
This article was posted on Jan 12, 2023PMIC supply to grow 4.7% in H1, says TrendForce
With TI – the leading supplier for PMICs – bringing on-stream new capacity at its RFAB2 and LFAB sites, TrendForce projects that the global production capacity for power management ICs will increase by 4.7% YoY for 1H23.
This article was posted on Jan 12, 2023CES: Bullitt to unveil satellite messaging service
Bullitt, the UK mobile phone manufacturer is unveiling two-way satellite messaging service – Bullitt Satellite Connect – at CES 2023. The service will be commercially available in Q1 2023.
This article was posted on Jan 12, 2023CES: Red micro-LED displays from AlInGaP aimed at AR glasses
Micledi Microdisplays has revealed red micro-LED demonstrators as CES today, using AlInGaP as a starting material.
This article was posted on Jan 11, 2023Qualcomm puts cockpit and ADAS functions on one chip
Qualcomm is sampling the Snapdragon Ride Flex SoC which integrates digital cockpit, ADAS and AD functions on one chip. Production is scheduled for 2024.
This article was posted on Jan 11, 2023CES: Bosch senses turn rate, acceleration, magnetism, pressure and particulates
Bosch Sensortec announced four sensors all on the same day at CES in Las Vegas.
This article was posted on Jan 11, 2023CES: CEVA licenses vision DSP to LG
LG has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip (SoC) ‘LG8111’ to advance the user experience of a new generation of smart home appliances.
This article was posted on Jan 11, 2023CES: NXP adds i.MX 95 family
NXP has brought out its i.MX 95 family, the newest addition to its i.MX 9 series of applications processors.
This article was posted on Jan 11, 2023Open Cosmos launches Earth Observation satellite for Open Constellation
Open Cosmos, the Harwell, Oxfordshire-based company, has successfully launched its MENUT Earth Observation satellite into space.
This article was posted on Jan 11, 2023Rallying cry from imec CEO
Imec CEO Luc Van den hove (pictured) has called for a renewal of the spirit of international cooperation which has driven the semiconductor industry’s extraordinary progress and could be harnessed to solve the world’s political challenges.
This article was posted on Jan 11, 2023Novel carbonaceous anodes prolong sodium ion battery life
Researchers from Korea and USA have developed an anode for sodium-ion batteries which can still store energy after 1,000 charge-discharge cycles, claims Pusan National University, which worked with the University of Illinois at Urbana Champaign.
This article was posted on Jan 11, 2023Farnell signs Gateworks for Arm industrial single board computers
Farnell is to distribute industrial single board computers from Gateworks.
This article was posted on Jan 11, 202350MP image sensor with DCG technology
In April, OMNIVISION intends to sample a 50MP image sensor with a dual conversion gain (DCG) technology.
This article was posted on Jan 11, 2023COM-HPC and COM Express with Intel 13th generation Core processors
Congatec has announced COM-HPC Size A and COM Express 3.1 Compact Type 6 computer-on-modules (table below) based on soldered BGA 13th generation Core processors from Intel.
This article was posted on Jan 10, 2023CES: onsemi adds to EliteSiC
onsemi will demo three new members of its EliteSiC family at CES – the 1700 V EliteSiC MOSFET and two 1700 V avalanche-rated EliteSiC Schottky diodes.
This article was posted on Jan 10, 2023CES: Synaptics addresses wireless connectivity
At CES Synaptics is addressing on-the-go workplace, ubiquitous IoT connectivity; Edge AI processing, and enhanced experiences in mobility, including:
This article was posted on Jan 10, 202316,384 LEDs in a car headlight
Nichia and Infineon have come up with an integrated micro-LED light engine for HD adaptive driving beam applications.
This article was posted on Jan 10, 2023