Fan-Out packaging is increasingly being adopted in 5G, HPC and RADAR 77-GHZ and is going to grow to experience one of the sharpest growths for AiP applications (5G-driven) at a 76% CAGR between 2020 and 2025, says Yole Developpement.

Separately, (x)PU die partitioning and (x)PU + HBM applications are growing strongly at 20% CAGR and 52% CAGR respectively, over the same period. 

Both applications are showing a need for higher computing performance. Connectivity related applications, including Bluetooth, plus MEMS , PA and switches, are expected to power forward with a 14% CAGR.

Projected at 20.2% CAGR, UHD Fan-Out revenue will grow to US$1,532 million by 2025. 

New HPC products will emerge and more UHD Fan-Out will be needed as a cost-effective high-end package as compared to 2.5D interposers. 

Samsung Electronics is the leading IDM . PTI is the leading FOPLP OSAT , specializing in memory packaging. JCET China is the leading OSAT in China. 

All three are known to have started qualifying UHD FO with various customers, and it is included in their roadmaps.

Revenue from HD Fan-Out is expected to reach $1,291 million by 2025 with a CAGR of 15.8%. On the other hand, Core Fan-Out growth is moderately stagnant at 1% CAGR from 2019 to 2025. 

Although revenue from FOPLP is growing at 57% CAGR and FOWLP at 14% CAGR, FOWLP will still generate more than 2/3 of combined revenue in 2025.

The Fan-Out packaging industry is expected to rebound in 2021.