Intel is saying that its next generation CPUs will have a 20% performance improvement over the current generation.

The increase in performance will come not from process but from two design improvements – a new material for the capacitors and the use of what Intel calls SuperFin transistors.

“It is 20%, the largest intra-node jump ever in our history,” Raja Koduri (pictured), Intel’s chief architect, told Reuters, “it’s actually same as what you would get with one full Moore’s Law node of performance.”

They will be made on either Intel’s current 10nm process or at a foundry – presumably TSMC or Samsung.

Koduri says the process tweaks allow the new processors to be made inhouse or out of house.

The new processors, called Tiger Lake,  are to be launched on September 2nd.