The US Department of Defense has awarded Intel the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) programme.

The SHIP program enables the U.S. government to access Intel’s semiconductor packaging capabilities in Arizona and Oregon.

The project is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.

SHIP is sponsored by the Office of the Under Secretary of Defense for Research and Engineering and funded by the Trusted and Assured Microelectronics programme.

The second phase of the program will develop prototypes of multichip packages and accelerate advancement of interface standards, protocols and security for heterogeneous systems.

SHIP prototypes will integrate special-purpose government chips with Intel’s advanced, commercially available silicon products, including field programmable gate arrays, application-specific integrated circuits and CPUs.

This combination of technologies provides new paths for the U.S. government’s industry partners to develop and modernize the government’s mission-critical systems while taking advantage of Intel’s U.S. manufacturing capabilities.

SHIP provides the U.S. government access to Intel’s heterogeneous packaging technologies, including embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB (combining both EMIB and Foveros).