Qorvo has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center.

The SHIP program will ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of next-generation RF components.

The exclusive SHIP Other Transaction Agreement (OTA), worth up to $75 million, was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division.

This program is funded by the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD R&E) Trusted and Assured Microelectronics Program (T&AM), and is administered by the Strategic & Spectrum Missions Advanced Resilient Trusted System (S²MARTS) Other Transaction Agreement (OTA), managed by National Security Technology Accelerator (NSTXL).

Under the SHIP program, Qorvo will design and deliver the highest levels of heterogeneous packaging integration. This is essential to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.

Qorvo’s U.S.-based capabilities include advanced manufacturing, packaging and testing for both high- and low-power applications ranging from DC to 100 GHz. Qorvo holds a Defense Microelectronics Activity (DMEA) Category 1A trusted source certification for package assembly, test and wafer foundry services at its Richardson, TX location.

Qorvo offers GaN-on-SiC and GaAs ICs portfolio along with manufacturing processes in Bulk Acoustic Wave (BAW), Surface Acoustic Wave (SAW), Wafer-Level Packaging (WLP) and more.

Qorvo is the only GaN supplier to achieve a Manufacturing Readiness Level 10 (MRL10) rating from the DoD.