Renesas has  expanded its RA4 Series MCUs with RA4M3 devices operating at up to 100 MHz using the Arm Cortex-M33 core based on Armv8-M architecture.

The M3 MCUs have Arm TrustZone technology, Renesas’ Secure Crypto Engine, and a suite of new memory enhancements. They arevdesigned for low-power IoT applications that require a balance of high performance, strong security, and higher memory.
Power consumption  isc119uA/MHz in active mode running CoreMark from flash memory and 1.6mA in standby mode with standby wakeup times as fast as 30 µs.
For memory-intense applications, designers can combine Quad-SPI and SD-card interfaces with the MCUs’ built-in embedded memory to increase capacity.

The background operation and Flash Bank SWAP option is ideal for memory optimized firmware updates running in the background. The increased embedded RAM with parity/ECC also makes the MCUscsuitable for safety-critical applications.
The devices also feature several integrated features to lower BOM costs, including capacitive touch sensing, embedded flash memory densities up to 1 MB, and analog, communications, and memory peripherals.
Fabbed in a 40nm process the chips have 1 MB flash memory, 128 KB RAM, 8 KB Data Flash and 1 KB stand-by SRAM.
Operating current isc119 μA/MHz in active mode and 1.6 mA standby current with 30 µs wakeup time.
Interfaces includecQuad SPI and SDHI memory interfaces, SSI, USB2.0 Full Speed, SCI, and SPI/I2C Scalable from 64-pin to 144-pin LQFP packages (including LGA- and BGA-ready options)
The Flexible Software Package (FSP) allows customers to re-use their legacy code and combine it with software from partners across the vast Arm ecosystem and the RA partner ecosystem to speed implementation of complex connectivity and security functions. The FSP includes FreeRTOS and middleware, offering a premium device-to-cloud option for developers.
These out-of-box options can be replaced and expanded with any other RTOS or middlewar. The FSP provides a host of efficiency enhancing tools for developing projects targeting the RA4M3 MCUs.
The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. The FSP uses a GUI to simplify the process and dramatically accelerate the development proces