Author: EIS Release Date: Feb 15, 2021
ADI's ADAQ23875 is a precision, high speed, μModule data acquisition solution that reduces the development cycle of a precision measurement systems by transferring the design burden of component selection, optimization, and layout from the designer to the device.
Using system in package (SiP) technology, the ADAQ23875 reduces end system component count by combining multiple common signal processing and conditioning blocks in a single device, solving many design challenges. These blocks include a low noise, fully differential analog-to-digital converter (ADC) driver (FDA), a stable reference buffer, and a high speed, 16-bit, 15 MSPS successive approximation register (SAR) ADC.
Using Analog Devices, Inc., iPassives® technology, the ADAQ23875 also incorporates crucial passive components with superior matching and drift characteristics to minimize temperature dependent error sources and offer optimized performance. The fast settling of the ADC driver stage, with fully differential or single-ended to differential input and no latency of the SAR ADC, provides a unique solution for high channel count multiplexed signal chain architectures and control loop applications.
The small footprint, 9 mm x 9 mm CSP_BGA package enables smaller form factor instruments without sacrificing performance. Single, 5 V supply operation is possible while achieving optimum performance from the device. The ADAQ23875 features a serial low voltage differential signaling (LVDS) digital interface with one-lane or two-lane output modes, allowing the user to optimize each application's interface data rate. The specified operation of the μModule is from -40°C to +85°C.
The EVAL-ADAQ23875FMCZ evaluation board enables simplified evaluation of the ADAQ23875 15 MSPS, 16-bit, high speed, precision μModule data acquisition solution. The evaluation board demonstrates the performance of the ADAQ23875 μModule and is a versatile tool for a variety of applications.
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