Toshiba's AEC-Q101 qualified compact-body semi-power MOSFETs support a wide range of automotive applications for battery systems from 12 V to 48 V including power line load switches, LED headlights, and BMS cell balance circuitry.

As opposed to the existing gull-wing lead type SOT-23 package, the SOT-23F is a Toshiba proprietary flat-lead featured package, which improves thermal dissipation through increased heat sinking contact area between the package and the print circuit board (PCB). As mount quality and reliability under harsh thermal environments is a usual concern for flat-lead type packages, we have ensured that thermal cycling requirements for automotive applications have been met while also maintaining footprint compatibility to the predecessor SOT-23 package.

By combining sophisticated wafer processing and packaging techniques, the SSM3K341R and SSM3K361R in the SOT-23F package boasts industry-leading R_DS(ON) of 36 mΩ and 65 mΩ (at VGS = 4.5 V) respectively. The low on-resistance allows a reduction in application size while also reducing energy losses. In addition, both devices support a maximum channel temperature of +175°C and can be used extensively in automotive applications where the operating environment is demanding.