19 new fabs being started this year

Author: EIS Release Date: Jul 6, 2021

Construction of 19 new high-volume fabs will have started by the end of this year, says SEMI’s World Fab Report, and next year construction will start on another 10.

 

China and Taiwan lead with eight fabs each, followed by the Americas with six, Europe/Mideast with three, and Japan and Korea with two each (Figure 1).

 

300mm fabs will account for 15 of the 19 being started this year, and seven out of the ten to be started next year.

 

The remaining seven fabs planned in 2021-22 will be 100mm, 150mm and 200mm facilities.

 

The 29 fabs could produce as many as 2.6 million wafers per month (in 200mm equivalents).

 

“Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to address the global chip shortage,” says SEMI CEO Ajit Manocha, “in the medium and longer term, the fab capacity expansion will help meet projected strong demand for semiconductors stemming from emerging applications such as autonomous vehicles, artificial intelligence, high-performance computing, and 5G to 6G communications.”