BAE Systems furthers defence collaboration with Intel

Author: EIS Release Date: Aug 31, 2021

BAE Systems has announced another strategic business agreement for its FAST Labs R&D organisation having early access to selected Intel technologies.

 

The agreement, says the company, is intended to help accelerate development of military applications. The agreement will enable it “to develop and more quickly field next-generation defense applications based on Intel’s most advanced technology”. No further details were given in the statement on the technologies involved.

 

BAE Systems furthers defence collaboration with IntelThe announcement follows other collaborations between BAE Systems and Intel, such as on Intel’s updated Agilex FPGA technology and the SHIP-Digital programme, which is intended to extend Intel’s wideband radio frequency signal processing platform to power- and size- constrained defence applications.

 

“Early access to Intel’s developing technology can speed the timetable of producing defense applications and maintain our country’s technological edge,” said Chris Rappa, director at BAE Systems’ FAST Labs. “Closing the development gap – potentially by years in some cases – will deliver a critical advantage to our country.”

 

SHIP

At the end of last year, the U.S. Department of Defense awarded Intel the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) programme. This gave the government access to Intel’s semiconductor packaging capabilities in Arizona and Oregon.

 

The project is executed by the U.S. Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.

 

“Intel and the U.S. government share a priority to advance domestic semiconductor manufacturing technology,” said Jim Brinker, president and general manager of Intel Federal LLC, back in October 2020. “The SHIP program will enable the Department of Defense to take advantage of Intel’s advanced semiconductor packaging capabilities, diversifying their supply chain and protecting their intellectual property while also supporting ongoing semiconductor R&D in the U.S. and preserving critical capabilities onshore.”