Infineon sampling smart home BLE IC

Author: EIS Release Date: Jan 13, 2022

Infineon  is sampling the AIROC CYW20829 Bluetooth LE SoC –  a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.

 

The chip is designed to support the entire spectrum of BLE use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls and any other Bluetooth LE-connected IoT application.

 

The device integrates a power amplifier with 10 dBm of transmit output power and has receive sensitivity of -98.5 dBm for LE and -106 dBm for LE-LR 125 Kbps for the best link budget in the AIROC Bluetooth portfolio.

 

The device is the first Infineon AIROC Bluetooth SoC to use the ARM Cortex M33. The BLE subsystem is architected for low current consumption with a highly optimized radio and an ARM Cortex M33 core focused as the Bluetooth controller. A second ARM Cortex M33 with a floating-point unit is dedicated for customer applications and can be clocked up to 96 MHz to provide high performance compute at low power.

 

The application sub-system is highly integrated with configurable serial communication blocks that can be turned into UART/I 2C/SPI as needed, multiple timer/counter pulse-width modulators, I 2S, PDM, CAN and LIN interfaces.

 

Security is built into the platform architecture with a ROM based root of trust, a TRNG, eFuse for custom keys and cryptography acceleration. For added flexibility, AIROC CYW20829 also supports XIP from external flash as well as encryption on the fly for content on the flash.

 

The Chip is supported by ModusToolbox – a collection of software and tools enabling rapid development of Bluetooth enabled IoT solutions.