Chiplet consortium to develop packaging standard

Author: EIS Release Date: Mar 10, 2022

Intel, TSMC, Samsung, Qualcomm, ASE, AMD, Arm, Google Cloud, Microsoft and Meta are to pursue a die-to-die interconnect packaging standard called Universal Chiplet Interconnect Express (UCIe).

 

Nvidia is not in the consortium, although the members say they are prepared to accept new members.

 

The  UCIe standard is aimed at developing a die-to-die interconnect standard allowing chips from different companies to be integrated into  the same package.