Ice Lake-D on COM Express basic type 7

Author: EIS Release Date: Mar 10, 2022

Kontron has adopted Intel Ice Lake-D processors for a COM Express basic type 7 computer-on-modules, and has an evaluation carrier board to go with them.

 

Kontron-IceLakeD-COMExpress

Called COMe-bID7, they will be available with Xeon D-1700 processors scaling from 4 to 10 cores and accommodates up to 4x SO-DIMM sockets for a maximum of 128Gbyte of memory.

 

A soldered NVMe SSD with up to 1 Tbyte of storage will be an option.

 

Interfaces include 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR – the latter the physical interface to be defined on the base board: KR for backplane connectivity, copper (RJ45) or fibre (SFP+).

 

 

Real-time enhancements are provided through Intel Time Coordinated Computing (TCC) and Time Sensitive Network (TSN).

 

The carrier board, COMe Eval Carrier T7-Gen2, offers a set of standard interfaces and, through adapter cards, the choice of Ethernet interface: 4x RJ45, 4x 10G-KR ports or 4x SFP+ ports

 

Operation is over -40 to +85°. “The module targets applications in embedded IoT for Industry 4.0, use cases such as test and measurement, autonomous vehicles and robotics, as well as AI workloads. Applications in the network edge include use cases such as multi-access edge computing or 5G RAN,” said Kontron production v-p Peter Müller.

 

Both module and carrier board are sceduled to be available in April.