Embedded World: 11th Gen Intel Core CPUs in COM Express Type 6 and 3.5inch SBCs

Author: EIS Release Date: Jun 10, 2022

Seco has introduced a COM Express Type 6 Compact Module and a 3.5inch single board computer built around 11th Gen Intel Core processors – also known as Tiger Lake UP3.

 

Seco Calypso Prisma

“11th Gen Core processors combine CPU/GPU engines with integrated artificial intelligence acceleration and deep learning capabilities in a low power processing platform, built on Intel third-generation 10nm process technology,” according to Seco.

 

There is the Calypso (left in photo) COM Express 3.0 Type 6 Compact Module with up to four cores, with some of the versions, designed for industrial applications, also including Intel’s ‘functional safety essential design package’. Some of the indstrial parts have IBECC (in-band error correcting code) for enhanced reliability.

 

 

Integrated Intel Iris Xe graphics has up to 96 execution units and can drive up to four independent displays via DisplayPort, eDP, HDMI, DVI or LVDS interfaces.

 

 

 

Two DDR4 SODIMM slots are included for up to 64Gbyte of DDR4-3200 memory.

 

Connectivity options include: 4x SuperSpeed USB (5Gbit/s) host ports, 8x USB 2.0, 1x Gigabit Ethernet, 8x PCI-e x1 Gen 3, PEG x4 Gen 4 and an HD audio interface.

 

Windows 10, Windows 10 IoT Core and Linux operating systems are supported.

 

Applciations are foreseen in edge computing, digital signage, transportation and biomedical devices.

 

The 3.5inch SBCs are branded ‘Prisma‘ (right) and come with same memory support as Calypso, with IBECC available on sime industrial parts.

 

Up to four independent 4K displays can be driven via DP, eDP or LVDS interfaces.

 

Connectivity options include 2x 2.5 Gigabit Ethernet, M.2 slot for Wi-Fi/Bluetooth, 4x SuperSpeed USB (10 Gbps), 2x USB 2.0, 4x PCIe Gen 3, 8x GPIOs and HD audio interface.

 

Windows 10 IoT Enterprise LTSC, Linux LTS and Yocto operating systems are supported.

 

Operating over -40°C to +85°C, Prisma boards are aimed at industrial automation, control, surveillance, gaming and edge computing.

 

All the above boards are compatible with Seco’s Clea AI/IoT platform which connects edge electronic devices to the cloud and facilitates real-time device monitoring, analytics, infrastructure management, predictive maintenance and secure remote software updates.

 

Seco will be at Embedded World in Nuremberg – Booth 1-320, 21 – 23 June.