Tong Hsing and Kingpark merge

Author: EIS Release Date: Feb 28, 2020

Tong Hsing and Kingpark, the Taiwan  CMOS Image Sensor (CIS) packagers have agreed to merge in a deal which will make them one of the world’s largest packaging firms for the CIS segment, reports Digitimes.

 

60% of the CIS market is for smartphones but the automotive market for CIS is growing at 30% a year.

 

Tong Hsing. which is a wafer reconstruction specialist as well as a CIS packager, will buy all the shares of Kingpark which specialises in CIS packaging for auto.

 

Sony, with its 20Mpixel sensors has over 50% of the CIS market and is integrating sensor and AI processing functions.

 

Samsung is going for the CIS market by developing 108Mpixel arrays.