Micron shipping 232-layer NAND

Author: EIS Release Date: Aug 3, 2022

Micron is shipping  232-layer TLC NAND flash  fabbed in Singapore

 

The device delivers I/O speed 2.4GB/s and the chip has a density of 14.6 Gb/mm2.

 

The chip can store 1Tb which allows 2TB chip packages by stacking 16  232-layer dies.

 

Micron has shrunk its packaging and a single chip package measures 11.5mm x 13.5mm (~155mm2).