Sondrel architects the future

Author: EIS Release Date: Sep 14, 2022

At the beginning of a new custom chip development, the most important question is who to partner with to reduce risk and time to market (TTM).

 

Being first to market with a new, innovative chip could be worth millions if it establishes a market-leading position.

 

Last year, Sondrel launched its Architecting the Future series covering the SFA 100 to the SFA 350A.

 

These pre-packaged, SoC IP architectures provide a fast track for designing a new chip as all that is needed is to select the most suitable foundry and process, third party IP and to integrate any of the customer’s own IP to create a custom solution.

 

They also reduce the risk by being off-the-shelf. Sondrel’s supply chain manufacturing service has further reduced risk and TTM as it has created a series of pre-packaged supply chains specifically tailored for each of its Architecting the Future platforms.