Siemens EDA certified for TSMC 3/4nm

Author: EIS Release Date: Nov 3, 2022

TSMC has certified an array of  Siemens’ EDA products for its 3nm and 4nm processes, while establishing 3D IC enablement, further advancement of EDA in the cloud, and a range of other  initiatives.

 

Siemens’ Calibre Platform tool for IC physical verification sign-off is certified for TSMC’s  N4P and N3E processes.

 

The Calibre nmPlatform tool products certified for TSMC’s N4P and N3E processes include: Calibre nmDRC software, Calibre YieldEnhancer software, Calibre PERC  software, Calibre xACTM software and Calibre nmLVS software.

 

TSMC has also certified  the Siemens mPower analogue software solution for transistor-level EM/IR sign-off for TSMC’s N3E process.

 

This  allows TSMC’s customers to apply the mPower  EM/IR signoff solution to analogue designs.

 

Siemens’ Analog FastSPICE platform for circuit verification of nanometer analogue, radio frequency (RF), mixed-signal, memory, and custom digital circuits has also been certified  for TSMC’s  N4P and N3E processes.

 

As part of the custom design reference flow (CDRF) for TSMC’s N3E process, Siemens’ Analog FastSPICE platform now supports TSMC’s Reliability Aware Simulation technology, which addresses IC aging and real-time self-heating effects among other advanced reliability features.

 

TSMC’s N4P CDRF also includes Siemens’ Solido Variation Designer software for advanced variation-aware verification at 3, 4, 5, and 6+ sigma.

 

TSMC has launched the new OIP 3DFabricAlliance to speed up customer adoption and production of 3D IC designs, and also to accelerate ecosystem readiness for TSMC’s 3DFabricTMtechnologies, a family of 3D silicon stacking and advanced packaging technologies.

 

Siemens has become an initial member of TSMC’s 3DFabric Alliance for the EDA category.  Siemens collaborates with TSMC on Xpedition Substrate Integrator software, Xpedition Package Designer software, HyperLynx software, Calibre 3DSTACK software and Tessent software solutions to support customers’ 3D IC designs using 3DFabric technologies.

 

The Calibre xACT software is used to extract interconnect parasitics and Through-Silicon Vias (TSVs) in complex 3D stacking and packaging configurations.

 

Accurate and efficient high-frequency extraction of transmission line-like structures, as well as interposers’ high-speed signal buses connecting High Bandwidth Memories (HBMs) and SoCs that are critical in todays advanced process designs were demonstrated in 3DFabric design-enablement qualifications.

 

To help mutual customers deploying 3D IC architectures in their next generation ICs, Siemens has enhanced its Calibre 3DSTACK software to support TSMC’s 3Dblox standard for heterogeneous process DRC and LVS checking, as well as for thermal analysis through Siemens’ Simcenter Flotherm software.

 

For thermal analysis, the Calibre software combined with Simcenter Flotherm software has been certified fulfilling required accuracy and has been enhanced to enable automatic extraction, power map generation and simulation of the complete 3D IC assembly. Calibre platform in the cloud

 

Through the TSMC OIP Cloud Alliance initiative, TSMC has collaborated with Microsoft and Siemens on best known methods for running Siemens’  Calibre nmDRC software on Microsoft Azure.