At Electronica today, Onsemi announced a series of silicon mosfets with top-side cooling for automotive motor control and dc-dc conversion.
Onsemi TCPAK57 TCPAK10
They come in a 5.1 x 7.5mm TCPAK57 package (aka ‘TCPAK10’, recommended footprint 5.2 x 8.7mm) with a 16.5mm2 thermal pad on the top side.
“This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board,” according to the company. “Improved reliability of the new design adds to an overall extended system lifetime.”
On-resistance is as low as 1mΩ (Vg=10V) amongst the devices (list below) with a gate charge of 86nC.
The initial portfolio includes 40, 60 and 80V devices, all capable of operating with junctions at 175°C, qualified to AEC-Q101 and PPAP capable.
“This, along with their gull wings that allows inspection of solder joints and superior board level reliability, makes them ideally suited to demanding automotive applications,” said Onsemi. “Target applications are motor controls such as electric power steering and oil pumps.”
NVMJST0D9N04C 40V, 300A, 1mΩ, 86nC
NVMJST1D2N04C 40V, 268A, 1.2mΩ, 82nC
NVMJST1D4N06CL 60V, 250, 1.46mΩ, 91nC
NVMJST1D6N04C 40V, 319A, 1.65mΩ, 47nC
NVMJST2D6N08H 80V, 157A, 2.8mΩ, 64nC
NVMJST3D3N04C 40V, 102A, 3.3mΩ, 23nC
Samples are available, full-scale manufacture planned in January 2023.