Canon launches back-end i-line stepper for 3D packaging

Author: EIS Release Date: Jan 9, 2023

Canon has brought out a back-end process semiconductor lithography i-line stepper system for 3D  packaging technologies with a 0.8 µm resolution and an exposure field of 100 mm x 100 mm.

 

The FPA-5520iV LF2 Option

 

The FPA-5520iV LF2 Option

 

3D technology designed to stack semiconductor chips for increased performance (conceptual image)

 

Exposure of single large-size wafer through 4 shots (4 shots x 4 times)

 

Exposure of single large-size wafer is done through 4 shots (4 shots x 4 times)

 

The FPA-5520iV LF2 Option reduces distortion aberration of less than 1/4 that of its predecessor model, the FPA-5520iV LF Option (released in April 2021), and features a new projection optical system with greater light level uniformity.

 

These advancements allow LF2 Option steppers to provide 0.8 µm resolution across a large 52 mm × 68 mm single-exposure field at while also making possible an ultra-wide 100 mm x 100 mm exposure field.

 

The FPA-5520iV LF2 Option inherits the basic performance of the FPA-5520iV, which has the ability to handle warped reconstituted substrates an issue which can occur in packaging layers during the mass-production process, as well as high productivity to enhance availability by detecting alignment marks—even on the reconstituted substrates with large chip array variations.