Author: EIS Release Date: Mar 18, 2020
Macom has introduced transimpedance amplifiers for optical comms ranging from 100Gbit/s DR1 to 800Gbit/s DR8 and FR8.
There are two parts, which come in flip chip and wire bonding packaging options for deployment in QSFP, QSFP-DD and OSFP optical modules.
“The rapid evolution to single lane 100G and multiple lanes 200G, 400G and 800G connectivity is increasing the demand for high-performance, power-efficient optical components needed to maximize bandwidth density in the cloud data center,” according to the company.
Both devices include RSSI for photo-alignment and power monitoring and I2C control of bandwidth, output amplitude, peaking, LOS, gain and other parameters.
Electronics Weekly has asked Macom more information on these devices.