IEDM has issued its 2023 Call for Papers

The paper submissions deadline is Thursday July 13th 2023.

 

IEDM 2023 will feature special Focus Sessions on the following topics:

Sustainability in Semiconductor Device Technology and Manufacturing
Logic, Memory, Package and System Technologies for Future Generative AI
3D Stacking for Next-Generation Logic & Memory Scaling by Wafer Bonding and Related Technologies
Neuromorphic Computing for Smart Sensors
IEDM 2023 Plenary Speakers:

 

Siyoung Choi, President & GM, Samsung Foundry Business
Björn Ekelund, Corporate Research Director, Ericsson
Thy Tran, Vice President of DRAM Process Integration, Micron
IEDM 2023 Short Courses:

Transistor, Interconnect, and Chiplets for Next Generations of Low-Power & High-Performance Computing
The Future of Memory Technologies for High-Bandwidth Memory and High-Performance Computing
SAN FRANCISCO, CA (May 15, 2023) – Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

The 2023 IEDM is being planned as an in-person conference December 9-13, 2023 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event for those unable to travel.

The paper submission deadline is Thursday, July 13, 2023. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent, most noteworthy developments. The late-news submission deadline is August 21, 2023.

The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics, and modeling. Each year, the world’s leading technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations, and other events highlighting the industry’s best work.

IEDM 2023 encourages submissions in all areas, with special emphasis on:

Neuromorphic computing/compute-in-memory/AI
Quantum computing devices
Devices for RF, 5G/6G, THz and mmWave
Advanced memory technologies
Advanced logic technologies and power distribution network
Novel materials for next-generation devices
Non-charge-based materials, devices and systems
Advanced power devices, modules and systems
Sensors, MEMS and bioelectronics
Devices/circuits/system interaction
Advanced packaging, and package/device-level interactions
Electron device simulation and modeling
Reliability of electronic devices
Robustness/security of electronic circuits and systems
Optoelectronics, displays and imaging systems
The IEDM 2023 technical subcommittees are as follows:

Advanced Logic Technology (ALT)
Emerging Device and Compute Technology (EDT)
Memory Technology (MT)
Power, Millimeter Wave and Analog Technology (PMA)
Modeling and Simulation (MS)
Optoelectronics, Displays and Imagers (ODI)
Neuromorphic Computing (NC)
Reliability of Systems & Devices (RSD)
Sensors, MEMS and Bioelectronics (SMB)