More customers for Intel 18A

Author: EIS Release Date: Jul 31, 2023

Boeing and Northrop Grumman will join a programme to develop, tape-out, and fabricate test circuits in preparation for product design tape-outs using Intel’s 18A process technology.

 

18A is scheduled to be “manufacturing ready” in 2024 and is billed as the node which overtakes TSMC’s process technology.

 

Nvidia, Qualcomm, Microsoft, IBM, Cadence and Synopsys are also engaged in the programme and helping to develop 18A test chips. 18A process development “continues on track”, says Intel.

 

The programme – designed to facilitate early access to advanced foundry processes – was developed by the US Department of Defence and has three strings to its bow: 

 

 

RAMP (Rapid Assured Microelectronics Prototypes);

RAMP-C – where ‘C’ stands for Commercial; and

SHIP (State-of-the-art Heterogeneous Integration Prototype)  for packaging.