Automated 3D solder paste inspection down to 9.8μm

Author: EIS Release Date: Aug 23, 2023

Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards.

 

TRI 3d solder measurement

Called TR7007Q SII it has a 9.8μm 21Mpixel camera and RGB+W lighting, and can be equipped with coaxial lighting.

 

It supports communication protocols including IPC Connected Factory Exchange (CFX), IPC-DPMX and IPC Hermes 9852.

 

 

TRI 3d solder paste inspection machineDetected defects include insufficient paste, excessive paste, shape deformity, missing paste and bridged pads. Available measurements are height, area, volume and offset.

 

 

Maximum PCB dimensions are 510 x 460mm (0.6 – 5mm thick) up to 3kg and the unit is 1 x 1.5 x 1.65m without its signal tower, weighing 795kg.