Alpha and Omega Semi launches MRigidCSP packaging technology

Author: EIS Release Date: Sep 12, 2023

Alpha and Omega Semiconductor, the power discretes specialist, has introduced its MRigidCSP packaging technology for battery management applications.

 

Designed to decrease on-resistance while increasing mechanical strength, AOS initially offers its MRigidCSP technology on its AOCR33105E,12V common-drain dual N-channel MOSFET.

 

 

 

 

AOS’ package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.

 

 

Fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices.

 

As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications.

 

A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength.

 

This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application.

 

The new AOCR33105E is designed with the latest trench-power MOSFET technology in a common drain configuration for design simplicity.

 

It features ultra-low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.