Smiths Interconnect launches Kepler

Author: EIS Release Date: Sep 13, 2023

Smiths Interconnect has launched its Kepler contact technology for IC Testing.

 

Kepler claims to be the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.

 

 

 

The semiconductor test industry has traditionally used vertical spring probes for BGA, LGA, QFN, and QFP packaging testing, while the cantilever scrubbing contact design has been used in peripheral segments to remove surface oxides and contaminants.

 

 

“The piercing effect of spring probes on gold pads has been a challenge due to the buildup of surface oxides,” says Smiths vp Brian Mutchell, “Kepler overcomes the challenges posed by traditional vertical spring probes and cantilever scrubbing contact designs.”

 

Kepler contact technology combines the scrub motion of a cantilever contact with the modular benefits of a spring probe.

 

The design includes horizontal movement during the downward stroke of the device to break surface oxides, provide stable and reliable contact, and cause no damage to the PCB.