The US has allocated $3 billion of Chips Act money to its National Advanced Packaging Manufacturing Program (NAPMP) with the aim of developing “critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to US manufacturing entities.“

“Within a decade, we envision that America will both manufacture and package the world’s most sophisticated chips,” says Laurie Locascio director of the US National Institute of Standards and Technology (NIST), “this means both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable and environmentally sound, and conducting the research to accelerate new packaging approaches to market.”

“The Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), details the vision, mission and objectives for the advanced packaging program created by the Chips Act.

The intention is to deliver a “vibrant, self-sustaining, high, volume, domestic, advanced packaging industry, where advanced-node chips, manufactured in the US, are packaged in the US”.

Advanced packaging is defined as having the ability to integrate multiple silicon die with large numbers of interconnects and achieve “a degree of integration that blurs the line between chip and package.”

The NAPMP will invest in design and simulation tools, manufacturing equipment and processes, R&D in materials and substrates, power delivery, and thermal management for advanced, packaging assemblies, a chiplet ecosystem, co-design of multi-chiplet subsystems with automated tools adapted for advanced packaging with consideration for built in test and repair, security, interoperability, and reliability.”

The Advanced Packaging Piloting Facility (APPF) will support the transitioning of these developments into high volume manufacturing.