Chomerics has formulated a thermal gap pad with low oil bleed, low oil migration “ideal for use where the appearance or production issues of silicone oils are undesirable, according to the company.

Parker Chomerics_THERM-A-GAP-PAD-80LO app
‘Pad 80LO’ (LO = low oil) has a typical thermal conductivity of 8W/mK and Shore 00 hardness of 60. Stress relaxation over time is nearly 90% reduction in compression force after one hour.

Parker Chomerics_THERM-A-GAP-PAD-80LO app

“It is designed to impart minimal stress on components such as integrated circuits, and provide vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern,” according to the company.

Pads made from the material are electrically isolating and have a UL flammability rating of 94 V-0.

It is available in sheets from 1mm to 5mm thick, or die cut to custom shapes and sizes.

Use is foreseen with GPUs and CPUs, and in equipment for telecomms, defense, energy storage and vehicles.