The VTT Technical Research Centre of Finland has been awarded €29 million of EU Chips Act money for chip packaging development under the EU APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) pilot line project.

“In the APECS project, VTT will focus in particular on the radio frequency technologies required for the 6G network and on the development and demonstration of optical microsystems and chip packaging methods,” says VTT vp Tauno Vähä-Heikkilä (pictured).

VTT is also involved in the  FAMES and NanoIC pilot line projects run by CEA-Leti and imec.

VTT’s activities in the APECS, FAMES and NanoICpilot lines will be located in Kvanttinova for which the Finnish government has granted €79 million in funding to build shared pilot lines.

 

Kvanttinova is an RDI Hub in microelectronics and quantum technology, jointly developed by VTT, Aalto University and the City of Espoo.

VTT’s shared-use cleanroom enables domestic companies to develop and pilot microelectronics components, systems and innovation and scale them up for production. The first semiconductor processes in Finland will start up towards the end of 2026.

VTT will also be developing photonics technologies for the EU PIXEurope pilot line for photonic ICs.