TE Connectivity’s MultiGig HD connector has been selected by the VITA Standards Organization as the next-generation VPX plug-in module connector.

 

Senior project manager, Mark Walmsley, revealed the VITA 100.30 connector plug-in module at Embedded Tech Trends. The modules features powerblades and stripline (four layer) wafers to optimise isolation. The wafers are thicker than those used for VPX and have key slots for precise contact / pad alignment. The backplane has been designed with ground shields for isolation between columns. Backplane shields connect to the back of the wafer to achieve coplanar ground, Walmsley explained.  The dual bean design, with four-point contacts provides two contact points per beam. Contacts are shrouded, with no exposed pins to bend.

The redesigned MultiGig HD connector doubles pin count, provides 112Gbit per second data rates and increases current capacity (up to 45A for 500W 6U, 12Vdc) for rugged environments. It is scheduled for release in the middle of this year.

The integrated wafer technology will support direct termination of AC coupling capacitors and eventually optical transceivers, said the company.

 

Mark Walmsley, speaking at Embedded Tech Trends 2025

Another design feature is the doubling of pin count, compared to VITA 46.x connectors, in order to support the higher data rates. The MultiGig HD was developed to support next-gen VPX, the rugged environmental requirements of VITA 47.3, and the extreme vibration levels of VITA 72 standards, said Walmsley.

The all-metal powerblades double capacity for extreme vibration levels. “We have learned what was missed in VPX and how to evolve,” Walmsley added.

The connector is segmented, so that it fits with existing RF and optical connector modules while optimising pin density. It is compatible with 3U, 4U (latest) and 6U OpenVPX form factors.