Smiths Interconnect has introduced its Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band).

The new Planar X Series is part of an initiative that entails the creation of cutting-edge board-level ceramic-based thick film RF filters, designed and tested to support various applications markets.

The small footprint, light weight and surface mountable configuration allow for high-volume pick and place applications and make Planar X Series ideal for

SATCOM, Radar and Broadcasting industries.

With the Planar X Series, Smiths Interconnect leverages existing thick film process technology upon various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:

• Compact size and light weight, resulting in reduced overall system mass in critical space applications
• Excellent rejection characteristics, providing best in-class RF performance
• Robust materials, suitable for harsh environment
• Integration capabilities