NXP and  Murata have combined to deliver RF front-end modules to Wi-Fi 6 standards.

The NXP FEIC comes in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. It enables 2×2 multiple input multiple output (MIMO) functionality.

“Murata is very pleased to work with NXP to develop RF front-end modules for Wi-Fi 6 platforms — NXP’s monolithic front-end ICs are fully verified in leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration,” says Murata’s  Katsuhiko Fujikawa.