With advanced logic processes now the exclusive  province of Intel, Samsung and TSMC,  it’s interesting to see how the three kings stack up.

Scotten Jones of IC Knowledge produces an illuminating insight for SemiWiki into where we are and where we may be next year.

“At the end of 2019, Samsung and TSMC both began risk production of 5nm processes and both processes are in production in 2020,” writes Jones, “5nm is where TSMC really stakes out a density lead.”

“The values for Samsung are all numbers that Samsung has confirmed,” says Jones, “the TSMC M2P is an incredible 28nm, a number we have heard rumoured in the industry. The rest of the numbers are our estimates to hit the density improvement TSMC has disclosed.”

When it comes to the next node – 7nm for Intel, 3nm for TSMC and Samsung –  TSMC’s superiority is even more apparent: