Smiths Interconnect, the manufacturer of IC Test Solutions for the semiconductor test industry, has announced enhancements to its Thermal Management Solutions product offering.

Utilising state-of-the-art system simulation models allows the company to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.

Traditional solutions including finned and liquid cooled heatsinks have been industry staples for many years but are limited in the amount of power they can support.

Smiths Interconnect has refined these options by introducing a Hi-Perform Liquid Cooled lid integrated with a Chiller as well as a Heatpipe | Heatsink variant.

These  solutions expand testing capabilities through the ability to dissipate 650 Watts. These lids stabilize the junction temperature within a desired range allowing for IC testing at a higher thermal power point for a longer duration resulting in a far more accurate test.

The products are developed specifically to a user’s exact application and can provide these additional benefits:

• Compatibility with conventional socket and lid-mounting design footprints allowing for simple conversion to an enhanced thermal management solution, therefore, increasing test accuracy.
• Availability of a compact, table-top chiller unit consuming minimal space in a test lab.
• Utilisation of existing test hardware, coolant mediums and air inlets, thereby requiring minimal investment for integration while reducing the overall cost of testing