Smiths Interconnect is using system simulation models to create custom heat removal lids for ICs under test.

“Traditional solutions including finned and liquid cooled heatsinks have been industry staples for many years but are limited in the amount of power they can support,” according to the company. “Smiths Interconnect has refined these options by introducing a liquid-cooled lid integrated with a chiller, as well as a heat-pipe and heatsink variant.”

Up to 650W can be removed to stabilise the IC’s junction temperature for testing at a high thermal power points for long durations.

Applications are foreseen in CPU and GPU chip test, with lids developed specifically for a user’s application with features including compatibility with conventional socket and lid mounting design footprints.

A table-top chiller unit is available, and existing test hardware, coolant mediums and air inlets can be used.

Smiths Interconnect has 25 sales, R&D and manufacturing locations in 12 countries, including Canada, US (California, Florida, Massachusetts, Kansas and Maryland), Mexico, Costa Rica, France, Germany, Italy, UK, Tunisia, India, China and Singapore. It is part of Smiths Group, which employs ~22,000 people in over 50 countries, and is listed on the London Stock Exchange.