Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL050T-FCS325I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 176 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 56340 | |
Total RAM Bits | 1869824 | |
Number of I/O | 200 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 325-TFBGA | |
Supplier Device Package | 325-BGA (11x11) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL050T-FCS325I | |
Related Links | M2GL050T, M2GL050T-FCS325I Datasheet, Microsemi SoC Distributor |
ECJ-ZEC1E040C | CAP CER 4PF 25V NP0 0201 | datasheet.pdf | ||
FFD35US-22528-X-P80 | MEMORY CARD FLASH 22GB | datasheet.pdf | ||
PPPC391LGBN-RC | Connector Header 39 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | ||
TNPW251273R2BETG | RES SMD 73.2 OHM 0.1% 1/2W 2512 | datasheet.pdf | ||
MCU08050D1101BP100 | RES SMD 1.1K OHM 0.1% 1/8W 0805 | datasheet.pdf | ||
M39003/01-5646 | CAP TANT 27UF 5% 35V AXIAL | datasheet.pdf | ||
CMF552R4900FKEB | RES 2.49 OHM 1/2W 1% AXIAL | datasheet.pdf | ||
852-80-058-20-002101 | CONN HDR 58POS 1.27MM T/H R/A | datasheet.pdf | ||
2N4339-E3 | MOSFET N-CH 50V 1.5MA TO-206AA | datasheet.pdf | ||
1-1338694-0 | ANVIL, COMBINATION .090 | datasheet.pdf | ||
BFC237025683 | CAP FILM 0.068UF 10% 100VDC RDL | datasheet.pdf | ||
GTC08F32-22S | GTC08F32-22S | datasheet.pdf |