Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-10175-P PLAIN ALUMINUM | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Boxes, Enclosures, Racks | |
| Family | Boxes | |
| Series | - | |
| Container Type | Chassis | |
| Size / Dimension | 10.000" L x 17.000" W (254.00mm x 431.80mm) | |
| Height | 5.000" (127.00mm) | |
| Area (L x W) | 170" (1097cm) | |
| Design | Cover Included | |
| Material | Metal, Aluminum | |
| Color | Unpainted | |
| Thickness | - | |
| Features | Cap (Cover) | |
| Ratings | - | |
| Material Flammability Rating | - | |
| Shipping Info | Shipped from Digi-Key | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 10175-P PLAIN ALUMINUM | |
| Related Links | 10175-P PLA, 10175-P PLAIN ALUMINUM Datasheet, LMB Heeger, Inc. Distributor | |
![]() | 3584JM | IC OPAMP GP 20MHZ HERMETIC TO3 | datasheet.pdf | |
![]() | RG2012N-5491-W-T5 | RES SMD 5.49KOHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | CMH322522-R68KL | FIXED IND 680NH 450MA 600 MOHM | datasheet.pdf | |
![]() | 74SSTUBF32868ABKG8 | IC BUFFER 28BIT CONF DDR2 176BGA | datasheet.pdf | |
![]() | 1624191-4 | POT 4.7K OHM 1/5W CARBON LINEAR | datasheet.pdf | |
![]() | PE-53808SNLT | FIXED IND 374UH 200MA 2.7 OHM | datasheet.pdf | |
![]() | 3-1625958-3 | RES 500K OHM 2W 1% RADIAL | datasheet.pdf | |
![]() | RWR89S4700DRS73 | RES 470 OHM 3W 0.5% WW AXIAL | datasheet.pdf | |
![]() | DTS24F17-99SE | CONN RCPT 23POS JAM NUT W/SKT | datasheet.pdf | |
![]() | XC6VSX315T-3FF1156C | IC FPGA 600 I/O 1156FCBGA | datasheet.pdf | |
![]() | ATS-13C-192-C3-R0 | HEATSINK 45X45X35MM R-TAB T412 | datasheet.pdf | |
![]() | ADSP-BR607BBCZ-5 | BLACKFIN PROCESSOR | datasheet.pdf |