Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-1301230155 | |
Lead Free Status / RoHS Status | Not applicable / Not applicable | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Industrial Controls, Meters | |
Family | Industrial Equipment | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 1301230155 | |
Related Links | 13012, 1301230155 Datasheet, Molex Connector Corporation Distributor |
![]() | RBM28DCTD | CONN EDGECARD 56POS DIP .156 SLD | datasheet.pdf | |
![]() | EP2C8T144C6 | IC FPGA 85 I/O 144TQFP | datasheet.pdf | |
![]() | MCP4261-503E/ST | IC DGTL POT DL 50K 2CH 14-TSSOP | datasheet.pdf | |
![]() | 2N1798 | THYRISTOR STUD 400V 70A TO-94 | datasheet.pdf | |
![]() | MLG0603P5N1ST000 | FIXED IND 5.1NH 350MA 400 MOHM | datasheet.pdf | |
![]() | VE-21T-EW-F2 | CONVERTER MOD DC/DC 6.5V 100W | datasheet.pdf | |
![]() | D38999/24FF35AE | CONN HSG RCPT JAM NUT 66POS PIN | datasheet.pdf | |
![]() | EP20K600EFC33-1X | IC FPGA 588 I/O 1020FBGA | datasheet.pdf | |
![]() | HM17508000J0G | 508 TB SP CLA DIP SOLDER | datasheet.pdf | |
![]() | MRS25000C1808FRP00 | RES 1.8 OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | 68000-608 | HEADER BERGSTIK | datasheet.pdf | |
![]() | MAL203133471E3 | 470UF 6,3V 8X18MM 85C 3000H | datasheet.pdf |