Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-2013266-2 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
RoHS Information | 2013266-2 Statement of ComplianceRoHS 2 Statement | |
3D Model | 2013266-2.pdf | |
Standard Package | 2,560 | |
Category | Connectors, Interconnects | |
Family | Memory Connectors - Inline Module Sockets | |
Series | - | |
Packaging | Tray | |
Connector Style | DIMM | |
Number of Positions | 240 | |
Memory Type | DDR 3 SDRAM | |
Standards | MO-269 | |
Mounting Type | Through Hole | |
Features | Board Guide, Latches | |
Mounting Feature | Normal, Standard - Top | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 2013266-2 | |
Related Links | 2013, 2013266-2 Datasheet, TE Connectivity AMP Connectors Distributor |
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