Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-2013311-3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| RoHS Information | 2013311-3 Statement of ComplianceRoHS 2 Statement | |
| 3D Model | 2013311-3.pdf | |
| Standard Package | 10,000 | |
| Category | Connectors, Interconnects | |
| Family | Memory Connectors - Inline Module Sockets | |
| Series | - | |
| Packaging | Tray | |
| Connector Style | SODIMM | |
| Number of Positions | 204 | |
| Memory Type | DDR 3 SDRAM | |
| Standards | - | |
| Mounting Type | Surface Mount, 25° Angle | |
| Features | Board Guide, Latches | |
| Mounting Feature | Reverse | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 2013311-3 | |
| Related Links | 2013, 2013311-3 Datasheet, TE Connectivity AMP Connectors Distributor | |
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