Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-233-60AB-10 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1,200 | |
Category | Fans, Thermal Management | |
Family | Thermal - Heat Sinks | |
Series | 233 | |
Type | Board Level, Vertical | |
Package Cooled | TO-220 | |
Attachment Method | Bolt On and PC Pin | |
Shape | Rectangular, Fins | |
Length | 0.600" (15.24mm) | |
Width | 0.570" (14.47mm) | |
Diameter | - | |
Height Off Base (Height of Fin) | 0.500" (12.70mm) | |
Power Dissipation @ Temperature Rise | 2W @ 58°C | |
Thermal Resistance @ Forced Air Flow | 11.0°C/W @ 400 LFM | |
Thermal Resistance @ Natural | 29°C/W | |
Material | Aluminum | |
Material Finish | Black Anodized | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 233-60AB-10 | |
Related Links | 233-6, 233-60AB-10 Datasheet, Wakefield Distributor |
![]() | 1544000000 | CONTACT 18-16 GLD I 2.5 250/PK | datasheet.pdf | |
![]() | RG1608N-9531-D-T5 | RES SMD 9.53KOHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | RG3216P-1372-B-T1 | RES SMD 13.7K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | FVXO-PC53B-1250 | OSC VCXO 1.25GHZ LVPECL SMD | datasheet.pdf | |
![]() | 382A012-3/42-0 | BOOT MOLDED "Y" SIZE 12 | datasheet.pdf | |
![]() | VI-J0M-EX-F3 | CONVERTER MOD DC/DC 10V 75W | datasheet.pdf | |
![]() | C901U101KYYDAAWL20 | CAP CER 100PF 400VAC Y5P RADIAL | datasheet.pdf | |
![]() | 5CGXFC4C6M13C7N | IC FPGA 175 I/O 383MBGA | datasheet.pdf | |
![]() | 181-11507 | SLOTTED WALL DUCT 1X1.5 | datasheet.pdf | |
![]() | 399-43-161-10-003000 | Connector Receptacle 61 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
![]() | MSP430I2041TPWR | IC MCU 16BIT FLASH TSSOP | datasheet.pdf | |
![]() | T551B476K050AH4251 | CAP TANT POLY 47UF 50V AXIAL | datasheet.pdf |