Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-4606X-AP1-562LF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Resistors | |
| Family | Resistor Networks, Arrays | |
| Series | 4600X | |
| Packaging | Tape & Box (TB) | |
| Circuit Type | Bussed | |
| Resistance (Ohms) | 5.6k | |
| Tolerance | ±2% | |
| Number of Resistors | 5 | |
| Number of Pins | 6 | |
| Power Per Element | 200mW | |
| Temperature Coefficient | ±100ppm/°C | |
| Operating Temperature | -55°C ~ 125°C | |
| Applications | - | |
| Mounting Type | Through Hole | |
| Package / Case | 6-SIP | |
| Supplier Device Package | 6-SIP | |
| Size / Dimension | 0.598" L x 0.098" W (15.19mm x 2.49mm) | |
| Height | 0.200" (5.08mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 4606X-AP1-562LF | |
| Related Links | 4606X-A, 4606X-AP1-562LF Datasheet, Bourns Inc. Distributor | |
![]() | EPF6016AQC208-3 | IC FPGA 171 I/O 208QFP | datasheet.pdf | |
![]() | 0541045096 | CONN FFC TOP 50POS 0.50MM R/A | datasheet.pdf | |
| DS1643-100+ | IC RTC CLK/CALENDAR PAR 28-EDIP | datasheet.pdf | ||
![]() | RG1608N-2801-D-T5 | RES SMD 2.8K OHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | 0674.400DRT4P | FUSE CERAMIC 400MA 250VAC AXIAL | datasheet.pdf | |
![]() | D3525W | RELAY TELECOM DPDT 2A 9V | datasheet.pdf | |
![]() | 0014567069 | CONN IDC 6POS 2.54MM 22AWG GOLD | datasheet.pdf | |
![]() | RN55D6800FB14 | RES 680 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 14-004-172 | CABLE 14POS .100 JUMPER 4 INCH | datasheet.pdf | |
![]() | 17021252003 | HAR-BUS HM MEL. TYP B25, AFS 2, | datasheet.pdf | |
![]() | ATS-10B-85-C1-R0 | HEATSINK 35X35X10MM R-TAB | datasheet.pdf | |
![]() | TVPS00RF-23-35JB-LC | TV 100C 100#22D SKT RECP | datasheet.pdf |