Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-53309-2691 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| 3D Model | 53309-2691.stp | |
| Standard Package | 1,000 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | 53309 | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Header, Outer Shroud Contacts | |
| Number of Positions | 26 | |
| Pitch | 0.031" (0.80mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount, Right Angle | |
| Features | - | |
| Contact Finish | Tin | |
| Contact Finish Thickness | 120µin (3.05µm) | |
| Mated Stacking Heights | - | |
| Height Above Board | 0.185" (4.70mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 53309-2691 | |
| Related Links | 53309, 53309-2691 Datasheet, Molex Connector Corporation Distributor | |
![]() | MPC9449FA | IC CLK BUFFER 3:15 200MHZ 52LQFP | datasheet.pdf | |
![]() | 22-28-4162 | CONN HEADER 16POS .100 VERT TIN | datasheet.pdf | |
![]() | ISL90462TIE627Z-TK | IC XDCP 32-TAP 100KOHM SC70-6 | datasheet.pdf | |
![]() | CT24BK175-L | 24" BLACK 175LB CABLE TIE | datasheet.pdf | |
| AGL125V5-CSG196 | IC FPGA 133 I/O 196CSP | datasheet.pdf | ||
![]() | B32621A5683K | CAP FILM 0.068UF 10% 160VDC RAD | datasheet.pdf | |
![]() | 310000010362 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | LELK1-1RS4-31840-32-V | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
![]() | IMA3361C | SENS INDUCT PROX 3W PNP NC 2M | datasheet.pdf | |
| UMW1C470MDD1TP | CAP ALUM 47UF 20% 16V RADIAL | datasheet.pdf | ||
![]() | 10-72132-17S | CONN RCPT 4POS INLINE SKT | datasheet.pdf | |
![]() | XQC300-4BG352N | QPro Virtex 2.5V QML High-Reliability FPGAs IC | datasheet.pdf |