Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-56F731-040 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 25 | |
| Category | Connectors, Interconnects | |
| Family | D-Sub Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 56F731-040 | |
| Related Links | 56F73, 56F731-040 Datasheet, API Technologies Corp Distributor | |
![]() | LT1768CGN#PBF | IC CTRLR CCFL SGL/MULT HP 16SSOP | datasheet.pdf | |
![]() | IRS2103SPBF | IC DRIVER HALF-BRIDGE HV 8-SOIC | datasheet.pdf | |
![]() | RMCF2010FT4R75 | RES SMD 4.75 OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | IXTA38N15T | MOSFET N-CH 150V 38A TO-263 | datasheet.pdf | |
![]() | 284147-2 | 3 POS.070 MULTILOCK MALE CONN. | datasheet.pdf | |
![]() | 89H48T12G2ZCBLI | IC PCI SW 48LANE 12PORT 676BGA | datasheet.pdf | |
![]() | LCMD240-10CD-5 | LUG COPPER 2 HOLE | datasheet.pdf | |
![]() | ATS-04H-142-C2-R0 | HEATSINK 30X30X15MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-20D-107-C1-R1 | HEATSINK 50X40X9.5MM XCUT | datasheet.pdf | |
![]() | PLA30WH5 | PREM 3D FLMNT WHITE | datasheet.pdf | |
![]() | STD09Y-R | MARKERS | datasheet.pdf | |
![]() | CTV07RW-15-55PD-P2AD | HD 38999 55C 55#23 PIN RECP | datasheet.pdf |