Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-5AGZME3H3F35I4N | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Customizable ARM-Based SoC | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Arria V GZ | |
Number of LABs/CLBs | 16980 | |
Number of Logic Elements/Cells | 360000 | |
Total RAM Bits | 23946240 | |
Number of I/O | 414 | |
Number of Gates | - | |
Voltage - Supply | 0.82 V ~ 0.88 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FBGA (35x35) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 5AGZME3H3F35I4N | |
Related Links | 5AGZME3, 5AGZME3H3F35I4N Datasheet, Alt Distributor |
0215005.MXE | FUSE CERAMIC 5A 250VAC 5X20MM | datasheet.pdf | ||
EXB-18V122JX | RES ARRAY 4 RES 1.2K OHM 0502 | datasheet.pdf | ||
TLV2782CDR | IC OPAMP GP 8MHZ RRO 8SOIC | datasheet.pdf | ||
02013J1R8ABSTR | CAP THIN FILM 1.8PF 25V 0201 | datasheet.pdf | ||
RN60E3402BB14 | RES 34K OHM 1/4W .1% AXIAL | datasheet.pdf | ||
40166-0075 | SAFETY MAT 1000X1000MM | datasheet.pdf | ||
NCP1850FCCT1G | IC BATT CHRGR SW 1.5A 25FLIPCHIP | datasheet.pdf | ||
UCZ1E122MNQ1MS | CAP ALUM 1200UF 20% 25V SMD | datasheet.pdf | ||
GHV38033 | CAP TRIM 0.8-39PF 1.25KV SMD | datasheet.pdf | ||
TX41AC00-0804 | CONN BACKSHELL ADPT SZ 8 9 SLVR | datasheet.pdf | ||
CB35221507 | CONN BARRIER STRIP 15CIRC .437 | datasheet.pdf | ||
ADP166AUJZ-3.3-R7 | IC REG LDO 3.3V 0.15A 5TSOT | datasheet.pdf |