Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-658-60ABT3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 700 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Heat Sinks | |
| Series | 658 | |
| Type | Top Mount | |
| Package Cooled | BGA | |
| Attachment Method | Thermal Tape, Adhesive (Included) | |
| Shape | Square, Pin Fins | |
| Length | 1.100" (27.94mm) | |
| Width | 1.100" (27.94mm) | |
| Diameter | - | |
| Height Off Base (Height of Fin) | 0.598" (15.20mm) | |
| Power Dissipation @ Temperature Rise | 2.5W @ 30°C | |
| Thermal Resistance @ Forced Air Flow | 2.0°C/W @ 500 LFM | |
| Thermal Resistance @ Natural | - | |
| Material | Aluminum | |
| Material Finish | Black Anodized | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 658-60ABT3 | |
| Related Links | 658-6, 658-60ABT3 Datasheet, Wakefield Distributor | |
![]() | AMM22DRES | CONN EDGECARD 44POS .156 EYELET | datasheet.pdf | |
![]() | 672M-02ILF | IC DELAY BUFFER QUADRACLK 16SOIC | datasheet.pdf | |
![]() | HRPG-AD32#53F | ENCODER MINI 32CPR 7.6X6MM | datasheet.pdf | |
![]() | 55G LARGE | GLOVES LARGE 1PAIR | datasheet.pdf | |
![]() | RLR07C22R0GSRE6 | RES 22 OHM 2% 1/4W AXIAL | datasheet.pdf | |
![]() | RN70D5620FB14 | RES 562 OHM 3/4W 1% AXIAL | datasheet.pdf | |
![]() | DTS26W9-98SN | CONN PLUG 3POS STRGHT W/SKT | datasheet.pdf | |
![]() | ATS-10G-27-C1-R0 | HEATSINK 70X70X12.7MM XCUT | datasheet.pdf | |
![]() | ATS-13B-89-C2-R0 | HEATSINK 35X35X30MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-13D-130-C2-R0 | HEATSINK 60X60X15MM XCUT T766 | datasheet.pdf | |
![]() | MSK-45 | FUSE MIDGET SERVICE KIT | datasheet.pdf | |
![]() | XC2V10000-6FFG1517C | Field Programmable Gate Array, 15360 CLBs, 10000000 Gates, CMOS, PBGA1517 IC | datasheet.pdf |