Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-71T75602S133BGI | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 84 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous ZBT | |
| Memory Size | 18M (512K x 36) | |
| Speed | 133MHz | |
| Interface | Parallel | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 119-BGA | |
| Supplier Device Package | 119-PBGA (14x22) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 71T75602S133BGI | |
| Related Links | 71T7560, 71T75602S133BGI Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | A22-CR-01M | SWITCH PUSH SPST-NC 10A 110V | datasheet.pdf | |
![]() | ACB64DHAD | CONN EDGECARD 128PS R/A .050 DIP | datasheet.pdf | |
![]() | F1206A2R00FSTR | FUSE BOARD MOUNT 2A 32VDC 1206 | datasheet.pdf | |
![]() | 60S2-TP | DIODE GEN PURP 200V 6A DO201AD | datasheet.pdf | |
![]() | CA3100F32-5P13 | CONN RCPT 2POS WALL MNT W/PINS | datasheet.pdf | |
| SIM3U1XX-B-DK | KIT DEVELOPMENT SIM3U1XX | datasheet.pdf | ||
![]() | RLR07C3303GRR36 | RES 330K OHM 2% 1/4W AXIAL | datasheet.pdf | |
![]() | T4811100 | CONTROL TEMP RELAY OUT 85-250V | datasheet.pdf | |
![]() | S0402-47NF3B | FIXED IND 47NH 150MA 830 MOHM | datasheet.pdf | |
![]() | RCER71E335K2M1H03A | CAP CER 3.3UF 25V X7R RADIAL | datasheet.pdf | |
![]() | ATS-06B-89-C3-R0 | HEATSINK 35X35X30MM R-TAB T412 | datasheet.pdf | |
![]() | 338212-2 | 25P.HDP20 REC.ASSY | datasheet.pdf |