Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-71T75602S166BGGI | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 84 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous ZBT | |
| Memory Size | 18M (512K x 36) | |
| Speed | 166MHz | |
| Interface | Parallel | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 119-BGA | |
| Supplier Device Package | 119-PBGA (14x22) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 71T75602S166BGGI | |
| Related Links | 71T75602, 71T75602S166BGGI Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | C100F103G | THERMISTOR NTC 10K OHM 2% TOLER | datasheet.pdf | |
![]() | OP4177ARZ-REEL7 | IC OPAMP GP 1.3MHZ 14SOIC | datasheet.pdf | |
![]() | 8-146485-8 | CONN HEADR 76POS .100" DUAL ROW | datasheet.pdf | |
![]() | RNC55H1960BSRE6 | RES 196 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | CMF551M0000FHBF | RES 1M OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | XPEBWT-U1-R250-007F8 | LED XLAMP WARM WHITE 2850K 2SMD | datasheet.pdf | |
![]() | 0603R-4N7J | FIXED IND 4.7NH 700MA 120 MOHM | datasheet.pdf | |
![]() | 1025R-40J | FIXED IND 6.8UH 185MA 2 OHM TH | datasheet.pdf | |
| 501ABE-ABAG | OSC PROG 0.7NS 30PPM 3.2X5MM | datasheet.pdf | ||
![]() | 8N3SV76KC-0058CDI8 | IC OSC VCXO 669.3266MHZ 6-CLCC | datasheet.pdf | |
![]() | ECC60DKMH | CONN EDGECARD 120POS .100" | datasheet.pdf | |
![]() | ATS-06B-17-C2-R0 | HEATSINK 54X54X12.7MM XCUT T766 | datasheet.pdf |